Całkowicie automatyczna maszyna do rozrzedzania płytek Si SiC GaN do szlifowania ultracienkiej płytki

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Całkowicie automatyczna maszyna do rozrzedzania płytek Si SiC GaN do szlifowania ultracienkiej płytki

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April 17, 2025

Połączenie kategorii: Sprzęt naukowy laboratoryjny

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Tagi:

#miernik transmitancji UV #miernik przepuszczalności światła #Całkowicie automatyczna maszyna do rozrzedzania płytek

Krótki: Discover the Fully Automatic Wafer Thinning Machine, designed for ultra-thin wafer grinding of Si, SiC, and GaN materials. This advanced machine ensures high precision, uniformity, and surface quality, making it ideal for semiconductor fabrication, power devices, and MEMS applications. Learn how it revolutionizes wafer thinning with real-time monitoring and adaptive control.

Powiązane cechy produktu:

Supports wafer sizes from Ø2" to Ø12" (up to 300mm) with customizable options.
Achieves ultra-thin wafer thicknesses as low as 50μm, with a minimum possible thickness of 20μm.
Ensures high precision with thickness accuracy of ±1μm and surface roughness <5nm Ra.
Features a diamond cup grinding wheel with stepless speed control (500-6000 rpm).
Includes a porous ceramic vacuum chuck and integrated water + air cooling system.
Operates via touchscreen with PLC control for adjustable and programmable parameters.
Optional features include auto loading/unloading, thickness monitoring, and CCD alignment.
Widely used in 3D IC packaging, power devices, MEMS, RF chips, and academic research.

Pytania i odpowiedzi:

What materials can be processed by this wafer thinning machine?

The machine is compatible with silicon (Si), silicon carbide (SiC), gallium nitride (GaN), sapphire, gallium arsenide (GaAs), and more.
How does this wafer thinning machine ensure uniform thickness?

It uses a precision grinding head with real-time thickness monitoring and adaptive control systems to maintain consistent thinning results.
What is the thickness range of this wafer thinning machine?

Wafers can be thinned to 50μm or even thinner, depending on the material and application requirements.