Krótki: Discover the Precision Diamond Wire Saw Cutting Machine with Stable Tension Control, designed for cutting hard and brittle materials like silicon carbide, sapphire, and ceramics. This high-performance machine offers dual workstations, upward-swing cutting, and a cutting speed of up to 1000 meters per minute for efficient and precise slicing.
Powiązane cechy produktu:
Mechanizm tnący z ruchem w górę dla ulepszonego przenoszenia materiału.
Fully servo-driven motor system ensures smooth, precise movement.
Stable tension control maintains consistent wire tension during operation.
High operational precision and stability for demanding applications.
Diamond wire cutting speed up to 1000 meters per minute for efficient slicing.
Gęstość cięcia wynosi od 1,5 mm do 80 mm dla wszechstronnej obróbki.
Dual workstations enhance cutting efficiency and operational flexibility.
Wide applicability for materials like silicon carbide, sapphire, and ceramics.
Pytania i odpowiedzi:
What materials can the Precision Diamond Wire Saw Cutting Machine process?
The machine is designed for hard and brittle materials, including silicon carbide (SiC), sapphire, ceramics, precious metals, quartz, and semiconductor materials.
Jaka jest prędkość cięcia piły diamentowej?
Prędkość cięcia drutem diamentowym może osiągnąć do 1000 metrów na minutę, co umożliwia wydajne cięcie i zwiększa zdolność produkcyjną.
How does the stable tension control feature work?
The stable tension control system uses closed-loop feedback to maintain consistent wire tension during operation, preventing wire breakage and ensuring precise cuts.